Board Solutions

Mpression offers board solutions in forms of evaluation board, development boar and starter kit with ICs and components from broad line up of Macnica's franchised suppliers.

Mpression offers board solutions in forms of evaluation board, development boar and starter kit with ICs and components from broad line up of Macnica's franchised suppliers.

All of the designs are with careful consideration for signal integrity (SI) being recently apparent issues at high speed signals and power integrity (PI) being also problematic with lowering trend of voltage and high current, and we can offer the design data as reference design that the customers can make use for their own designs.

FPGA Evaluation/Development Boards

Intel® Arria® V GX broadcasting application development board.

Intel® Cyclone® V GX Starter Board

System on Module with Intel® Cyclone® V SoC FPGA.

Intel® Cyclone® V SoC Starter Kit.

LCD touch bundle for Helio Board.

Intel® Cyclone® V GX FPGA automotive infotainment extension board

Intel® Cyclone® V GX multi I/O board.

Intel® Cyclone® V ST SoC Evaluation Board

Daughter Cards with Various I/Os

100 BaseT-1 BroadR-Reach PHY, HD camera module, DisplayPort, audio I/F daughter card.

An extension card having BroadR-Reach® 100BASE-T PHY, HD Image Sensor camera module, DisplayPort® interface, and Audio CODEC, for various FPGA development kits with High Speed Mezzanine Card (HSMC) connector defined by Intel®.

FMC daughter card for SDI interface extension at multi-rate of 12G-SDI, 6G-SDI, 3G-SDI, HD-SDI, and SD-SDI.

FMC (Intel®+) daughter card for evaluation of 3G-SDI/HD-SDI/SD-SDI.

PCI Express cable, 1000Base-T ethernet PHY, UART, SRAM/Flash HSMC daughter card.

A daughter card to use with base boards with Altera FPGAs to attain Gigabit Ethernet.

HSMC daughter card for evaluation of IEEE1588 precision time protocol.

LVDS connector HSMC card.

MIPI D-PHY DSI interface LCD HSMC card.

FMC daughter card with SFP+ connector for evaluation of High Speed Serial Transceivers in FPGA

FMC daughter card with SMP connector for evaluation of High Speed Serial Transceivers in FPGA.

USB 3.0 I/F HSMC card.

FMC (Intel®+) Card for V-by-One HS IP core.

IoT/Wearable Product Development Kits

IoT/M2M sensor shield with contactless strain sensor.

Wireless sensor network terminal with thin PV module.

Monitoring kit developed for measuring electrical power.

A Bluetooth®, low-energy, small module compatible with the Konashi base board.

The Mpression Odyssey Bluetooth SMART Sensor Board is ideal for doing proof-of-concept experiments using this Internet of Things development platform.

The kit includes both the MAX 10 FPGA board and the Bluetooth® SMART Sensor board. They can be used singly or together, giving the designer many choices of processing capability when planning and developing their system.

IoT Sensor Shield for Konashi & Arduino.