Macnica today announced, after 5 years since the release, Macnica's Mpression Odyssey MAX10 Eval Kit is going to the end of life with the last time buy on November 30, 2019. The Odyssey apps will stop its service on March 31, 2020 and the server will be shut down.

At that time even previously installed phone applications will stop functioning with Odyssey.  If you have a concern with this, please contact us at info.mai@macnica.com.

Continuing to enhance the flexibility and capability of EasyMVC !

Macnica is developing and adding new machine vision interface boards to its EasyMVC family, CoaXPress^® 2.0 board and 10GigE Vision board. Now, they are available for demonstration! Coming soon for production!

Enable immediate development of MV camera with the leading-edge CMOS image sensors and Vision interfaces.

YOKOHAMA, Japan (November 1, 2018) – Macnica, Inc. (Headquarter: 1-6-3 Shin-Yokohama, Kohoku-ku, Yokohama, Japan President: Kiyoshi Nakashima) today announced the launch of “EasyMVC” developed originally, --- a Machine Vision Camera Development Kit that will enable users to promptly evaluate and develop not only the leading-edge CMOS image sensors but also the most advanced vision interfaces --- Output interface of Machine Vision Camera.

Support to develop sensing device, manufacture production products and introduce maintenance system.

YOKOHAMA, Japan (Nov 17, 2016) – Macnica, Inc., a leading global technical distributor for semiconductor and networkingproducts, today announced Mpression predictive maintenance introduction support service using IoT sensing devices as a Mpression IoT Solution. Macnica completely supports following menu.

Solve to build highly-trusted and robust mesh network in the field

YOKOHAMA, Japan (Sept 7, 2016) – Macnica, Inc., a leading global technical distributor for semiconductor and networking products, today announced the availability of its IoT mesh network starter kit. This kit is sold through Altima corp. that is subsidiary of Macnica.

Support open innovation for MAKERS x maker and expansion of young generation MAKERS

Macnica is cosponsoring Maker Faire Tokyo 2016 to be held at TOKYO BIG SIGHT from August 6 to 7, 2016 as Mpression for MAKERS.

Macnica continues to support MAKERS from 2014 launched Mpression for MAKERS.

At Maker Faire Tokyo 2016, Macnica cosponsoring and operates "Learn to lead" and " Prototype to Product" to support open innovation for MAKERS x maker and expansion of young generation MAKERS.

YOKOHAMA, Japan (July 12, 2016) – Macnica, Inc., a leading global technical distributor for semiconductor and networking products, today announced the availability of its myThings starter kit konashi Edition as a Mpression for MAKERS to Japanese customer collaborating with IDC Frontier Inc. The kit contains IoT sensor shield "Uzuki" ,Bluetooth® Smart module "Koshian" developed by Macnica and physical computing kit "konashi" for iOS devices developed by Yukai Engineering Inc. Macnica sells myThings starter kit konashi Edition through Macnica Online store.

Yokohama, May 9, 2016 - Macnica, Inc. today announced that it is exhibiting at Japan IT Week 2016 to be held at Tokyo big sight Tokyo from May 11 to 13, 2016.
Macnica booth showcases the embedded, security and ICT technologies by combining necessary elements for IoT in the form of proof of concept by Mpression.
For IoT security, network security solution was centering. On the other, Mpression offers IoT security from device to cloud network as a PoC.

YOKOHAMA, Japan (February 16, 2016) – Macnica, Inc., a leading global technical distributor for semiconductor and networking products, today announced the availability of its Mpression OpenCL Lab to Japanese customers.

YOKOHAMA, Japan (February 16, 2016) – Macnica, Inc., a leading global technical distributor for semiconductor and networking products, today released the Mpression Sodia board, a flexible platform based on the Altera® Cyclone® V ST SoC – the ARM® Cortex®-A9 based SoC FPGA. It is useful for quickly prototyping embedded systems combining the ARM based hardware processor system and the FPGA fabric in the Cyclone V SoC .