Reference Design for High Precision Buck and Invert Power Control

100 BaseT-1 BroadR-Reach PHY, HD camera module, DisplayPort, audio I/F daughter card.

An extension card having BroadR-Reach® 100BASE-T PHY, HD Image Sensor camera module, DisplayPort® interface, and Audio CODEC, for various FPGA development kits with High Speed Mezzanine Card (HSMC) connector defined by Intel®.

FMC daughter card for SDI interface extension at multi-rate of 12G-SDI, 6G-SDI, 3G-SDI, HD-SDI, and SD-SDI.

Expands to 8 channels of HD/3G/6G/12G multi-rate SDI interface

24GHz MIMO Radar module Evaluation Kit is a MIMO Radar module with Analog Devices ADF5901 24 GHz VCO and PGA with 2-Channel PA Output and ADF5904 4-Channel 24 GHz Receiver Downconverter. MIMO (Multi Input Multi Output) technology used in this module enables long-distance and wide-range azimuth detection.

24V Output Isolated AC/DC Board for Industrial Applications

FMC daughter card for evaluation of 3G-SDI/HD-SDI/SD-SDI.

Intel® Arria® V GX broadcasting application development board.

Intel® Cyclone® V GX Starter Board

System on Module with Intel® Cyclone® V SoC FPGA.

Compatible with Mitsubishi Electric CP220.

IoT/M2M sensor shield with contactless strain sensor.

CoaXPress® not only achieves high-speed transmission of up to 12.5Gbps per cable from the camera to the host, but also enables the transmission of control packets and triggers from the host to the camera, as well as the supply of power.

can transmit data at 12.5Gbps via coaxial cable

Versatile Machine Vision Camera Development Kit. Can evaluate key technologies making up machine vision cameras, and make it easy to develop prototypes of machine vision camera.

Development kit for SMPTE ST2110 Media Over IP.

Wireless sensor network terminal with thin PV module.

The EH-Terminal GS2 is a sensor terminal with Analog Devices SmartMesh IP which allows for an easy mesh network deployment just by turning on the power.
The sensor terminal has a built-in gas sensor capable of wirelessly sensing the total volatile organic compound (TVOC) as one of the environmental indexes to measure the sum of the VOC density. The sensor terminal is also equipped with a temperature/humidity sensor, light luminance sensor, and accelerometer.

PCI Express cable, 1000Base-T ethernet PHY, UART, SRAM/Flash HSMC daughter card.

Enables quick development of applications conforming to the EMVA GenICam standard.

A daughter card to use with base boards with Altera FPGAs to attain Gigabit Ethernet.

High-speed image data transfer complying with GigE Vision standard.

Monitoring kit developed for measuring electrical power.

FMC / HSMC daughter card to expand HDMI 2.0 interface

Enables High speed interface compliant with HDMI 2.0 standard

Intel® Cyclone® V SoC Starter Kit.

LCD touch bundle for Helio Board.

Intel® Cyclone® V GX FPGA automotive infotainment extension board

Time synchronization complying with IEEE1588 standard.

HSMC daughter card for evaluation of IEEE1588 precision time protocol.

High-speed serial interface achieved using a lightweight protocol.

High-speed serial interface achieved using a lightweight protocol.

A Bluetooth®, low-energy, small module compatible with the Konashi base board.

This Kit is an evaluation module with SONY IMX537 CMOS sensor. It supports SLVS-EC v2.0 interface (8 lanes) of IMX537.

This Kit is an evaluation module with SONY IMX901 CMOS sensor. It supports SLVS-EC v3.0 interface (4 lanes) of IMX901.

This product is an interface card that connects Luminous Sensor EVM series to a board with FMC connector (such as FPGA development kit).

LVDS connector HSMC card.

Macnica offers Macnica Media Streaming SDK (M2S SDK), which enables implementation of software-based SMPTE ST2110 and AMWA NMOS IS-04/IS-05 compatible systems on general-purpose servers.

Compatible with Yaskawa Electric JL-100/JL-102 LSI

Professional Media over Managed IP Networks

MIPI D-PHY DSI interface LCD HSMC card.

MMC plus interface type card with a 4GByte eMMC.

Intel® Cyclone® V GX multi I/O board.

[EOL Notification Available] The Mpression Odyssey Bluetooth SMART Sensor Board is ideal for doing proof-of-concept experiments using this Internet of Things development platform.

[EOL Notification Available] The kit includes both the MAX 10 FPGA board and the Bluetooth® SMART Sensor board. They can be used singly or together, giving the designer many choices of processing capability when planning and developing their system.

Embedded SDK to realize OPC UA Server function recommended protocol by Industrie 4.0 as in “Reference Architectural Model Industrie 4.0”.

Multi-task real-time OS for small embedded devices.

The SENSPIDER is the best-in-class analog data acquisition unit, with all of the functionality needed for Industrial IoT applications. It is equipped with sensor interface slots for various types of analog sensors, edge compute capabilities and system network interface in a very small form factor.

FMC daughter card with SFP+ connector for evaluation of High Speed Serial Transceivers in FPGA

Next generation Sony CMOS image sensor interface.

SLVS-EC v3.0/3.1 Rx IP is an interface IP core that runs on Altera® FPGAs. Using this IP, you can quickly and easily implement products that support the latest SLVS-EC standard v3.1. You will also receive an "Evaluation kit" for early adoption.

FMC daughter card with SMP connector for evaluation of High Speed Serial Transceivers in FPGA.

Intel® Cyclone® V ST SoC Evaluation Board

Video transfer over IP, Supports PTP

Intel Agilex 5E production-grade system on a module ideal for development and product production.

HSMC daughter card for evaluation of Gigabit Ethernet equipped with Texas Instruments 1000Base-T Ethernet PHY

+/-12V Power Supply Reference Board for High-Precision, Ultra-Low Noise Analog Circuits

USB 3.0 HSMC INTERFACE CARD

USB 3.0 I/F HSMC card.

High-speed image data transfer complying with USB3 Vision standard.

IoT Sensor Shield for Konashi & Arduino.

FMC daughter card for V-by-One HS IP core

HSMC daughter card for V-by-One HS IP core

IP core for FPGAs that supports “V-by-One® HS plus Standard”, the next-generation high-speed interface standard technology developed by THine Electronics Inc.

High-speed serial interface compliant with V-by-One® HS standard.

Communication master for Yaskawa Electric motor encoders